Wärmeleitmaterialien
HITHERMTM Thermal Interface Materials
HITHERMTM Thermal Interface Materials for LEDs
- Operating temperature up to 400 °C
- Defined material thickness
Die cut Thermal Interface Pads for CoB (Chip-on-Board) LEDs available on sheets or on rolls. Samples available from stock.
- Production ready - Easy to apply
HITHERMTM Thermal Interface Materials
Delivery form
Application
- Pads on roll
- Pads on sheet
- max. width
HT-1200: 608 mm
HT-2500: 304 mm
- CPUs
- FPGAs
- Power LEDs
- Peltier Modules
- Laser-Tech
NEU HITHERMTM HT-C3200
HITHERMTM HT-C3200 for Power Modules
- Compressible up to 70 %
- Production ready - Easy to apply
- Defined material thickness
- Designed for Power Modules
Consistent, reliable thermal performance enabling zero maintenance applications. Assembly-ready foil form factor eliminates dispensing and cleaning processes
HITHERMTM HT-C3200
Thermal Conductivity
Through
W/mK
7.00
Thermal Conductivity
In-Plane
W/mK
800.0
Material Thickness
mm
0.20
Operating Temperature
°C
-40°C bis 400 °C
Halogen free
-
Yes
RoHS Conform
-
Yes
Mega Power Dual MPD2
EcoDual
PrimePack 2
PrimePack 3
FF300 R12KE3
1 - 5
<
>
Thermal Impedance [°C.cm2 / Watt]
Pressure [kPa]
© 2015 GrafTech International Holdings Inc. This information is based on data believed to be reliable but GrafTech makes no warranties, express or implied, as to its accuracy and assumes no liability arising out of
its use. The data listed falls within the normal range of product properties but should not be used to establish speci¿cation limits or used alone as the basis of design. GrafTech’s liability to purchasers is expressly
limited to the terms and conditions of sale. eGRAF®, SPREADERSHIELDTM and HITHERMTM are trademarks of GrafTech International Holdings Inc. eGRAF® thermal management products, materials, and
processes are covered by several US patents.
